CVE-2024-33019 | Qualcomm Snapdragon Auto up to X75 5G Modem-RF System TID-to-Link Mapping buffer over-read
A vulnerability classified as critical has been found in Qualcomm Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Wired Infrastructure and Networking. This affects an unknown part of the component TID-to-Link Mapping. The manipulation leads to buffer over-read.
This vulnerability is uniquely identified as CVE-2024-33019. It is possible to initiate the attack remotely. There is no exploit available.
It is recommended to upgrade the affected component.